Qualcomm Doubles Computing Power of Snapdragon With New Dual-CPU, Single-Chip Solution

Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced a new dual-CPU Snapdragon(TM) single-chip solution that extends the reach of the Snapdragon platform by targeting more advanced mobile computing devices. The QSD8672(TM) chip features two computing cores capable of up to 1.5GHz for greater processing capabilities, in addition to optimized battery life and a full range of 3G mobile broadband and peripheral connectivity capabilities found on all Snapdragon chipsets. Snapdragon-powered mobile computing devices combine the best of Smartphones and laptops, delivering advanced computing while enhancing the user experience with the always-on, connected characteristics of mobile handsets. Sampling is scheduled for the second half of 2009.

"This new dual-CPU Snapdragon chip demonstrates our long-term commitment to helping our customers develop a wide variety of innovative, data-centric, mobile computing devices," said Luis Pineda, senior vice president of marketing and product management for Qualcomm CDMA Technologies. "With its exceptional computing power and improved energy efficiency, the QSD8672 chip allows us to enable more advanced devices that are essentially always on, always awake and always connected."

The dual-CPU QSD8672 solution, with two highly integrated computing processors running at speeds of up to 1.5GHz, is designed to enable new classes of wirelessly connected computing and pocketable computing devices and deliver significant enhancements to Netbook devices currently on the market. Having two processing cores allows the chip to deliver an enhanced computing experience with more instantaneous response and greater ability to run multiple applications concurrently. The QSD8672 also will provide these devices with greater functionality, particularly 3G wireless broadband through the Company's industry-leading integrated multi-mode modems including HSPA+ for up to 28 Mbps on the downlink and up to 11 Mbps on the uplink. The chip integrates GPS, Bluetooth(R), 1080p high-definition video recording and playback and also supports Wi-Fi and mobile TV technologies such as MediaFLO(TM), DVB-H and ISDB-T. The integrated 2D and 3D graphics engines deliver device manufacturers the ability to offer products with display resolutions up to WSXGA (1440 x 900).

Together with radio frequency and power management chips, the QSD8672 provides a complete solution for mobile computing devices. Mobile computing devices running on the dual-CPU Snapdragon solution can offer displays from 9 to 12 inches in size with a form-factor that is smaller, thinner, lighter and quieter than laptops currently on the market. These devices also take advantage of integrated 3G connectivity and comprehensive peripheral connectivity capabilities, which complement and enable these portable form-factors. Running on Snapdragon chips also allows mobile computing devices to deliver powerful processing capabilities, transparent and reliable connectivity and exceptionally long battery life.

For more information on Snapdragon, visit: http://www.qctconnect.com/products/snapdragon.html

Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2008 FORTUNE 500 company. For more information, please visit http://www.qualcomm.com.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of the QSD8672 chip on a timely and profitable basis, the extent to which and pace by which Snapdragon-powered mobile computing devices are adopted, the Company's ability to successfully design and have manufactured significant quantities of CDMA and WCDMA components on a timely and profitable basis, the extent and speed to which CDMA and WCDMA are deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 28, 2008.

Qualcomm is a registered trademark of Qualcomm Incorporated. Snapdragon and QSD8672 are trademarks of Qualcomm Incorporated. All other trademarks are the property of their respective owners.

This press release may reference 1X EVDO parts whose manufacture, use, sale, offer for sale, or importation into the United States is limited or prohibited by certain injunctions against Qualcomm. The reference to such 1X EVDO parts in this press release is not an offer to sell such parts and shall not be misconstrued as assistance in the making, using, selling, offering to sell or importation of such parts in or into the United States. Any device utilizing such 1X EVDO parts that are intended for sale to wireless carriers (other than Verizon) in United States markets must also utilize Qualcomm's hybrid mode alternative solution.

Qualcomm Contacts:

Carla Vallone, Qualcomm CDMA Technologies

Phone: 1-858-651-8557